One or two 3rd Gen Intel^® Xeon^® Scalable Ice Lake processors (8300/6300/5300/4300 series), thermal design power (TDP) up to 270 W

Supports various drive configurations and hot swappable:

• 8 to 12 x 2.5-inch SAS/SATA/SSD drives

• 10 x 2.5-inch drives (6–10 NVMe SSDs and 0–4 SAS/SATA drives, with a total number of 10 or less)

• 10 x 2.5-inch drives (2–4 NVMe SSDs and 6–8 SAS/SATA drives, with a total number of 10 or less)

• 4 x 3.5-inch SAS/SATA/SSD drives

Supports flash storage:

• Dual M.2 SSDs

Supports RAID 0, 1, 10, 5, 50, 6, or 60, optional supercapacitor for cache data power failure protection, RAID level migration, drive roaming, self-diagnosis, and remote web-based configuration.

Provides expansion capability of multiple types of networks.

Provides the OCP 3.0 network adapter. The two FlexIO card slots support two OCP 3.0 network adapter respectively, which can be configured as required.

Supports the hot swap function.

Two hot-swappable PSUs in 1+1 redundancy mode. Supported options include:

• 900 W AC Platinum/Titanium PSUs (input: 100 V to 240 V AC, or 192 V to 288 V DC)

• 1500 W AC Platinum PSUs

1000 W (input: 100 V to 127 V AC)

1500 W (input: 200 V to 240 V AC, or 192 V to 288 V DC)

• 1500 W 380 V HVDC PSUs (input: 260 V to 400 V DC)

• 1200 W –48 V to –60 V DC PSUs (input: –38.4 V to –72 V DC)

• 2000 W AC Platinum PSUs

1800 W (input: 200 V to 220 V AC, or 192 V to 200 V DC)

2000 W (input: 220 V to 240 V AC, or 200 V to 288 V DC)

Chassis with 3.5-inch drives: 43.5 mm x 447 mm x 790 mm (1.71 in. x 17.60 in. x 31.10 in.)

Chassis with 2.5-inch drives: 43.5 mm x 447 mm x 790 mm (1.71 in. x 17.60 in. x 31.10 in.)